職責(zé)描述：
1-Create&Maintain Sub-system and Component Requirement spec, including Research current technology, negotiate with supplier, create and improve requirement spec.
創(chuàng)建和維護子系統(tǒng)和元件要求規(guī)范，包括研究當(dāng)前技術(shù)，與供應(yīng)商協(xié)商，創(chuàng)建和改善要求規(guī)范。
2-Create&Maintain design related engineering drawing/Bom and corresponding design specification
創(chuàng)建/維護相應(yīng)的工程圖紙，物料清單；以及相應(yīng)的設(shè)計規(guī)范。
3-Plan, design and perform electrical&mechanical specified hardware components unit test and system integration test and make qualified records
規(guī)劃，設(shè)計和執(zhí)行電氣或機械相關(guān)的硬件元件單元測試和系統(tǒng)集成測試, 并做好相應(yīng)的記錄
4-Monitor the returning of responsibly HW components and take s for improvement from technical side
監(jiān)控所負責(zé)部件的返修，并采取必要的技術(shù)措施進行改善。
5-uate Supplier via communication and controlling from technical point of view.
從工藝角度評估，溝通和控制供應(yīng)商
6-Drive responsible HW component improvement(CR/Charm) and technical supporting.
硬件元件改善（CR/Charm）和技術(shù)支持。
7-Cooperate with team members for Hardware concept and Engineering prototype developing.
合作開發(fā)硬件概念和工程原型。
8-Support hardware development related process improvement.
支持硬件開發(fā)流程的提高。

任職要求：
1-1~3 years experience in corrsponding hardware development or equal project experience under post graduate phase.
2-international orientation is essential experience with international employers and customers capabilities to operate in foreign cultures.
必須具備國際導(dǎo)向；有國際雇主和客戶的經(jīng)驗；能在外國文化中工作。
3-Moderate english speaking and writing skills.
具備適度的英語交流能力。